[PATCH 0/4] Improve Verdin AM62P thermal setup by generalizing ft_board_setup_ex()

[Tom Rini]

On Mon, 23 Jun 2025 14:39:53 -0300, João Paulo Gonçalves wrote:

> In some use cases, board-specific device tree changes must not be overwritten
> by system fixups. Although U-Boot provides ft_board_setup_ex() for this
> purpose, it is currently only used on TI Keystone. This series makes
> ft_board_setup_ex() a generic option, allowing its use by other architectures
> and boards.
> 
> Additionally, considering that Toradex Verdin-AM62P hardware lifetime
> guarantees are based on a 105°C junction temperature (while TI AM62Px supports
> up to 125°C), this series implements necessary changes within TI K3 AM62P and
> Toradex board code. These changes include exporting common fixup device Tree
> functions used in TI K3 for board-code access and also fixup for AM62P thermal
> zones to correctly reflect the number of CPU nodes according to the SoC part
> number.
> 
> [...]

Applied to u-boot/master, thanks!

[1/4] boot: Make ft_board_setup_ex() generic
      commit: 2b7c6b6f3ca34970be61c5189d263f94f0c94917
[2/4] arm: mach-k3: Export common fdt fixups for use in board code
      commit: 9e672e4260144bf43a5b38db48537ecc097d296c
[3/4] arm: mach-k3: am62p: fixup thermal cooling device by cpu number
      commit: 7f4baa866dd510fe123290526dc1c7387dd48255
[4/4] board: toradex: verdin-am62p: Add fixup for critical trip points
      commit: a03f4a632bf7c2337586394e5e7db6b368cfb37f
-- 
Tom