[PATCH] mtd: spi-nor: winbond: Make sure w25q{01, 02}jv behave correctly

[Tom Rini]

On Wed, 02 Jul 2025 11:23:13 +0200, Miquel Raynal wrote:

> These chips are internally made of two/four dies with linear addressing
> capabilities to make it transparent to the user that two/four dies were
> used. There is one drawback however, the read status operation is racy
> as the status bit only gives the active die status and not the status of
> the other die. For commands affecting the two dies, it means if another
> command is sent too fast after the first die has returned a valid
> status (deviation can be up to 200us), the chip will get corrupted/in an
> unstable state.
> 
> [...]

Applied to u-boot/next, thanks!

[1/1] mtd: spi-nor: winbond: Make sure w25q{01, 02}jv behave correctly
      commit: 4f76c90bad3867c402cae28b45c928626bedefff
-- 
Tom