[PATCH V7 01/15] board: siemens: iot2050: Split the build for PG1 and PG2

Andrew Davis afd at ti.com
Wed Mar 1 19:34:55 CET 2023

On 3/1/23 12:29 PM, Jan Kiszka wrote:
> On 01.03.23 18:26, Andrew Davis wrote:
>> On 2/28/23 12:19 PM, Jan Kiszka wrote:
>>> From: Su Baocheng <baocheng.su at siemens.com>
>>> Due to different signature keys, the PG1 and the PG2 boards can no
>>> longer use the same FSBL (tiboot3). This makes it impossible anyway to
>>> maintaine a single flash.bin for both variants, so we can also split the
>>> build.
>> Having two defconfigs just to make the small changes needed will be
>> more burden than it saves. Keeping them in sync and having your integration
>> layer do two different builds just adds more work than it is worth IMHO.
>> We (TI) are going in that direction for our HS boards and combining the
>> defconfigs back together now. The solution is to have the one defconfig
>> build both images, one for HS and one for non-HS. For you looks like you
>> are already calling the two PG boot images differently so this should work
>> (seboot_pg1.bin and seboot_pg2.bin). Just add a new full entry in
>> boot-image.dtsi for each (vs that #ifdef check changing the output name).
> How should that work? Will we somehow get two flash.bin out of a single
> build then?

Yes if you add two enteries in your image.dtsi file. Then your integration
selects the right named one for the board, instead of selecting the right
defconfig for the board and doing a completely new build.


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