[PATCH V7 01/15] board: siemens: iot2050: Split the build for PG1 and PG2

[Jan Kiszka]

On 01.03.23 18:26, Andrew Davis wrote:
> On 2/28/23 12:19 PM, Jan Kiszka wrote:
>> From: Su Baocheng <baocheng.su at siemens.com>
>>
>> Due to different signature keys, the PG1 and the PG2 boards can no
>> longer use the same FSBL (tiboot3). This makes it impossible anyway to
>> maintaine a single flash.bin for both variants, so we can also split the
>> build.
>>
> 
> Having two defconfigs just to make the small changes needed will be
> more burden than it saves. Keeping them in sync and having your integration
> layer do two different builds just adds more work than it is worth IMHO.
> 
> We (TI) are going in that direction for our HS boards and combining the
> defconfigs back together now. The solution is to have the one defconfig
> build both images, one for HS and one for non-HS. For you looks like you
> are already calling the two PG boot images differently so this should work
> (seboot_pg1.bin and seboot_pg2.bin). Just add a new full entry in
> boot-image.dtsi for each (vs that #ifdef check changing the output name).

How should that work? Will we somehow get two flash.bin out of a single
build then?

Jan

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