[v5,00/13] Qualcomm IPQ5210 SoC bringup

[Simon Glass]

Hi Varadarajan,

On 2026-06-17T10:17:59, Varadarajan Narayanan
<varadarajan.narayanan at oss.qualcomm.com> wrote:

> mach-snapdragon: Add commands to create wrapper ELF

Patches 1 and 2 introduce binman etypes (qcom-config, qcom-lib,
qcom-appsbl) to build the next-stage FIT, but patch 11 then drops back
to a custom Makefile.xpl + linker-script mechanism to wrap the SPL in
an ELF for the boot ROM. Two image-creation mechanisms for the same
SoC is what binman exists to avoid. Please can you see whether the
wrap-elf step can be expressed as a binman entry (an objcopy/ld
wrapping etype, or extending the existing qcom-* etypes) so the whole
flow lives in the binman dts?

> Working features ... Serial console, UART, MMC

Serial console and UART are the same thing here.

Regards,
Simon